Article-Journal

A TOOL BASED ON DL FOR UML MODEL CONSISTENCY CHECKING
Automated consistency checking of UML models becomes necessary as models grow in size and complexity. Since the UML metamodel does not …
Cite DOI URL
Bayesian Image Reconstruction Based on Voronoi Diagrams
We present a Bayesian Voronoi image reconstruction (VIR) technique for interferometric data. Bayesian analysis applied to the inverse …
Cite DOI URL
Designing a product family of meshing tools
Applying software engineering concepts can improve the quality of any software development, and this is even more dramatic for complex, …
Cite DOI URL
Generation of 3D mixed element meshes using a flexible refinement approach
This paper describes and discusses the main characteristics and implementation issues of a 3D mixed element mesh generator based on a …
Cite
Simulation of defects in aluminium castings using CAD models of flaws and real X-ray images
Cite URL
Improving the quality of meshes for the simulation of semiconductor devices using Lepp-based algorithms
Abstract This paper discusses a new post-process algorithm for generating valid Delaunay meshes for the Box-method (finite-volume …
Cite DOI URL
Automatic construction of non-obtuse boundary and/or interface Delaunay triangulations for control volume methods
Abstract A Delaunay mesh without triangles having obtuse angles opposite to boundary and interface edges (obtuse boundary/interface …
Cite DOI URL
Approximate Shape Quality Mesh Generation
We present two techniques for simplifying the list processing required in standard iterative refinement approaches to shape quality …
Cite
Terminal-edges Delaunay (small-angle based) algorithm for the quality triangulation problem
The terminal-edge Delaunay algorithm, initially called Lepp–Delaunay algorithm, deals with the construction of size-optimal (adapted to …
Cite DOI URL
Mixed element trees: a generalization of modified octrees for the generation of meshes for the simulation of complex 3-D semiconductor device structures
This paper addresses the problem of the allocation of spatial grids for complex nonplanar three-dimensional (3-D) semiconductor device …
Cite DOI